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SOLUTIONS

Supporting
the ambitious.

Complex silicon requires more than individual capabilities. It requires coordinated execution.

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Modern semiconductor programs span increasingly interdependent design disciplines. RTL, verification, timing, power, physical implementation, packaging, firmware, and validation must converge against the same performance, schedule, and production objectives.

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Sintegra brings these disciplines together to solve defined engineering objectives, from complex SoC implementation and advanced-node closure through tapeout, bring-up, and system validation.

End-to-End ASIC Implementation

From RTL handoff through GDSII and tapeout.

Sintegra provides end-to-end ASIC implementation support for complex SoCs, bringing together front-end design, synthesis, physical implementation, timing, power, verification, and signoff within a coordinated execution flow.
 

Our engineers can integrate into an existing implementation program at a critical stage or take ownership of a defined design scope through tapeout.

Design & Integration

RTL Design and Integration · IP Integration · CDC/RDC · LEC · UPF · Design Constraints

Solving the Engineering Problems That Define the Next Generation of Compute

Whether you’re building new silicon, scaling an AI cluster, integrating photonics, or architecting a custom system, Sintegra delivers the engineering depth to make it real.

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